VCs in $56m series-C for Kandou
Several venture capital investors have participated in a $56m series-C funding round for chip-to-chip communications company Kandou.
Bessemer Venture Partners, Columbia Lake Partners, Digital Transformation Fund, Fayerweather Capital Partners, Forestay Capital, Kreos Capital, Raging Capital, Swisscom Ventures and Walden International participated in the funding round.
The fresh capital will go towards expanding all aspects of the company's operations, and help accelerate the development and deployment of its products.
Previous funding
The Foundation for Technological Innovation provided the company with CHF 100,000 in debt financing in 2011.
Kandou received $10m from an undisclosed investor in 2012.
Bessemer led a $15m funding round in 2016. The firm joined up with Walden International in 2018 to lead a $15m series-B for the company.
Company
Founded in 2011, Kandou is a fabless semiconductor company headquartered in Lausanne, and with offices in Europe, North America and Asia. The company develops and produces high-speed chip-to-chip link products.
People
Bessemer Venture Partners – Felda Hardymon (partner).
Swisscom Ventures – Pär Lange (investment partner).
Forestay Capital – Frederic Wohlwend (managing director).
Kandou – Amin Shokrollahi (founder, CEO).
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